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Advances in Rtp Temperature Measurement and Control

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Abstract

This paper reviews work to develop and improve the temperature measurement and control technology of a commercial rapid thermal processing (RTP) system. A description of the main features of this system is given, which includes a concentric multi-zone lamp heating source, multi-point temperature measurement system and real time wafer temperature control. Innovations in RTP optical thermometry are described which resulted in improved low temperature performance, a real time spectral emissivity measurement tool which enables emissivity independent temperature measurement and an improved temperature calibration capability. The multi-input multi-output (MIMO) optimal wafer temperature control methodology is discussed. Process results demonstrating an equivalent process temperature performance of 4°C, 3-sigma, all-points-all-wafers will be presented.

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References

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Author information

Authors and Affiliations

  1. Applied Materials Thermal Processing Organization, 2727 Augustine Drive MS 0755, Santa Clara, CA, 95054, USA

    Bruce Peuse, Gary Miner & Mark Yam

  2. Oakleaf Engineering, Inc., 643 Bair Island Road, Suite 208, Redwood City, CA, 94063, USA

    Curtis Elia

Authors
  1. Bruce Peuse
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  2. Gary Miner
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  3. Mark Yam
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  4. Curtis Elia
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Corresponding author

Correspondence to Bruce Peuse.

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Peuse, B., Miner, G., Yam, M. et al. Advances in Rtp Temperature Measurement and Control. MRS Online Proceedings Library 525, 71–85 (1998). https://doi.org/10.1557/PROC-525-71

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  • DOI: https://doi.org/10.1557/PROC-525-71

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