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A new solder wetting layer for Pb-free solders

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Abstract

We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.

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ACKNOWLEDGMENT

This research was supported by the Korea Science and Engineering Foundation (KOSEF) through the Center for Electronic Packaging Materials (CEPM).

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Authors and Affiliations

  1. Division of Materials Science & Engineering, Hanyang University, Seoul, 133-791, Korea

    Chang Yul Oh, Hee-Ra Roh, Young Min Kim, Jin Soo Lee, Hae Young Cho & Young-Ho Kim

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  1. Chang Yul Oh
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  2. Hee-Ra Roh
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  3. Young Min Kim
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  4. Jin Soo Lee
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  5. Hae Young Cho
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  6. Young-Ho Kim
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Correspondence to Young-Ho Kim.

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Oh, C.Y., Roh, HR., Kim, Y.M. et al. A new solder wetting layer for Pb-free solders. Journal of Materials Research 24, 297–300 (2009). https://doi.org/10.1557/JMR.2009.0047

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  • DOI: https://doi.org/10.1557/JMR.2009.0047

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