Abstract
In recent years, polyimide film has become a commonly used insulator for microelectronic devices including advanced semiconductor chip and high density packaging. It has the advantages of low dielectric constant, thermal stability and low processing cost. In general, it is important to understand both the thermal and mechanical properties of a microelectronic material. Thermal and mechanical properties play very important roles in terms of determining the device structural integrity. Mismatch of material properties could cause feasibility and reliability problems. These properties are also essential for mechanical stress and thermal stress modeling studies. Biphenyldianhydride-Phenylenediamine (BPDA-PDA) and Pyromellitic Dianhydride-Oxydianiline (PMDA-ODA) are two commonly used polyimide films in electronic industry. Their thermal expansion coefficients and mechanical properties were studied and reported here.
Similar content being viewed by others
References
U.S. Patent No. 511,5090 (IBM Corp, K.G. Sachdev et al).
S. Herminghaus, D. Boese, D.Y. Yoon and B.A. Smith, Appl. Phys. Lett. Vol. 59, 1043 (1991).
D. Boese, S. Herminghaus, D.Y. Yoon, J.D. Swalen and J.F. Rabolt, Mat. Res. Soc. Symp. Proc., Vol. 227, 379 (1991).
Custom built by IBM German Manufacturing Technology Center.
G. Makosch and B. Solf, Proceedings of SPIE Vol. 316, 42 (1981).
J. Kempf, M. Nonnenmacher and H.H. Wagner, Appl. Phys. A47, 137 (1988).
J. Kempf and H.H. Wagner, Topics in Current Physics Volume 37: Thin Film and Depth Profile Analysis, Editor: H. Oechsner, Springer-Verlag, p.87 (1984).
G. Elsner, J. Kempft, J.W. Bartha and H.H. Wagner, Thin Solid Films, Vol. 185, 189 (1991).
D.Y. Yoon. W. Parrish. L.E. Depero and M. Ree, Mat. Res. Soc. Symp. Proc., Vol. 227. 387 (1991).
S. Numata and N. Kinjo, Poly. Eng. and Sci. Vol. 28, 906 (1988).
D.Y. Yoon (private communication).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Chen, S.T. Thermal And Mechanical Properties Of Polyimide Films. MRS Online Proceedings Library 381, 141–146 (1995). https://doi.org/10.1557/PROC-381-141
Published:
Issue Date:
DOI: https://doi.org/10.1557/PROC-381-141