Genome-Wide Modeling of Transcription Preinitiation Complex Disassembly Mechanisms using ChIP-chip Data
Figure 5
Six factor (TBP, TFIIB, Pol II, TFIIF, TFIIE, and TFIIH) modeling of genome-wide ChIP occupancy data using the assembly pathway TBP → TFIIB → pol II→ TFIIF → TFIIE → TFIIH.
See Figures 1 and 2 for panel descriptions.