Abstract
This report covers the results of a study on evaluating the effect of nano-SiC particles on mechanical, thermal and electrical properties of epoxy by lap shear, TGA, DSC and electrical tests. Epoxy composites filled with micro-SiC particles were also studied for comparison. The mechanisms of performance improvement were discussed in detail. The results showed that with identical loading, silane treated nano-SiC filled nanocomposites have the best properties. The volume resistivity decrease, dielectric constant ε increase and loss tangent tan(δ) increase by addition of silane treated nano-SiC particles are smaller than those by the other fillers. Silane treatment of nanoparticles improves each performance, including increases shear strength, thermal stability, volume resistivity and decreases ε and (δ). The addition of nano-SiC particles remarkably improves shear strength, ε and tan(δ), while slightly enhances thermal stability of epoxy. 8 vol. % silane treated nano-SiC/epoxy composite has the highest shear strength 10.6 MPa with the maximum enhancement, 80%, over the neat resin. It also has good temperature independence of dielectric properties and enough volume resistivity, which meet the demand of some microelectronics materials.
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References
E. Reynaud, C. Gauthier, and J. Perez, Rev. Metall./Cah. Inf. Tech., 96, 169 (1999).
P. Liu, M. Zhao, and J. Guo, J. Macromol. Sci., Part B: Phys., 45, 1135 (2006).
F. Bauer, U. Decker, H. Ernst, M. Findeisen, H. Langguth, R. Mehnert, V. Sauerland, and R. Hinterwaldner, Int. J. Adhes. Adhes., 26, 567 (2006).
N. Chisholm, H. Mahfuz, V. K. Rangari, A. Ashfaq, and S. Jeelani, Compos. Struct., 67, 115 (2005).
Q. L. Ji, M. Q. Zhang, M. Z. Rong, B. Wetzel, and K. Friedrich, Tribol. Lett., 20, 115 (2005).
R. M. Rodgers, H. Mahfuz, V. K. Rangari, N. Chisholm, and S. . Jeelani, Macromol. Mater. Eng., 290, 423 (2005).
J. W. Gilman, Appl. Clay Sci, 15, 31 (1999).
C. S. Reddy and C. K. Das, J. Appl. Polym. Set, 102, 2117 (2006).
A. Mahmood, S. Muhl, R. Machorro, A. Lousa, J. Esteve, and J. Heiras, Diamond Relat. Mater., 15, 71 (2006).
T. Zhou, M. Gu, Y. Jin, and J. Wang, Polymer, 46, 6216 (2005).
T. Zhou, X. Wang, M. Gu, and X. Liu, Polymer, 49, 4666 (2008).
I. L. Dubnikova, S. M. Berezina, and A. V. Antonov, J. Appl. Polym. Set., 94, 1917 (2004).
Y. Sun, Z. Zhang, and C. P. Wong, presented at IEEE, 9th International Symposium and Exhibition on Advanced Packaging Materials. Processes Prop Interfaces, 2004.
Y. Sun, Z. Zhang, K.-S. Moon, and C. P. Wong, J. Polym. Sci., Part B: Polym. Phys., 42, 3849 (2004).
T. J. Wooster, S. Abrol, J. M. Hey, and D. R. MacFarlane, Composite Part A: Applied Science and Manufacturing, 35, 75 (2004).
L. Ramajo, M. Reboredo, and M. Castro, Composites Part A: Applied Science and Manufacturing, 36, 1267 (2005).
H. Li, K. I. Jacob, C. P. Wong, and I. Fellow, IEEE Trans. Adv. Packag., 26, 25 (2003).
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Zhou, T., Wang, X., Gu, M. et al. Study on Mechanical, Thermal and Electrical Characterizations of Nano-SiC/Epoxy Composites. Polym J 41, 51–57 (2009). https://doi.org/10.1295/polymj.PJ2008173
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DOI: https://doi.org/10.1295/polymj.PJ2008173
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