Challenges for Scaled Damascene Interconnects

Silvia Armini¹, Johan Swerts¹, Nicolas Jourdan¹, Yong Kong Siew¹, Juergen Boemmels¹, Zsolt Tokei¹ and Herbert Struyf¹

© 2013 ECS - The Electrochemical Society
ECS Meeting Abstracts, Volume MA2013-02, E7-Processing, Materials, and Integration of Damascene and 3D Interconnects 5 Citation Silvia Armini et al 2013 Meet. Abstr. MA2013-02 2057 DOI 10.1149/MA2013-02/29/2057