3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques

Takafumi Fukushima¹, Kang Wook Lee¹, Jicheol Bea¹, Tetsu Tanaka¹ and Mitsumasa Koyanagi¹

© 2012 ECS - The Electrochemical Society
ECS Meeting Abstracts, Volume MA2012-02, E8 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4 Citation Takafumi Fukushima et al 2012 Meet. Abstr. MA2012-02 2719 DOI 10.1149/MA2012-02/34/2719