ECS Meeting Abstracts

Direct Growth of Thin Copper Wires by Electrodeposition

Thomas Schimmel¹, Sheng Zhong², Thomas Koch², Emil Nold², Thorsten Scherer², Harald Roesner², Stefan Walheim², Horst Hahn² and Mu Wang³

© 2005 ECS - The Electrochemical Society
ECS Meeting Abstracts, Volume MA2005-02, I1 - Electrodeposition of Nanoengineered Materials I Citation Thomas Schimmel et al 2006 Meet. Abstr. MA2005-02 635 DOI 10.1149/MA2005-02/15/635

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¹ University of Karlsruhe

² Forschungszentrum Karlsruhe

³ Nanjing University

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