Abstract
The presence of trichromate ions in the chromic acid solution is required to obtain a cathodic film from which metallic Cr may be deposited. With a high flow rate plating system, it was predicted from this proposed mechanism that bright, smooth, adherent deposits of Cr can be laid down on Cu or Fe substrates from solutions as dilute as 25 g/liter 
but no deposit from 1 g/liter
. A high speed plating process (HSP), based on an air pressure flow system (APFS) propulsion of electrolyte through a narrow gap between the cathode and anode separated by about 4 mm, was used to plate chromium metal on copper samples at rates up to 50 times faster from solutions 5 times as dilute as conventional chromium plating techniques. The HSP system, the APFS descriptions, and some selected results are presented.