Abstract
A method is described which allows in situ simultaneous measurement of mass changes and stress level during electrodeposition of nanometric films using the double quartz crystal method. The method is applied to Cu/FeNi electrodeposited multilayers. Compressive stresses are observed during the first stages of the electrodeposition of FeNi alloys. Large tensile stresses are observed for thicker FeNi layers. The work confirms the stress reducing effect of the copper layers.