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The role of migration mass transfer in the electrodeposition of nickel from sulfate-chloride and chloride solutions containing succinic acid

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Abstract

The electrodeposition of nickel from 0.5 M sulfate-succinate-chloride (I) and 0.3 and 0.5 M chloride-cuccinate (II) solutions at a temperature of 50°C is studied. It is found that, depending on the pH0 of solution and the concentration of succinic acid and nickel, the maximum cathodic current density for producing high-quality nickel deposits is to 35 A/dm2 in electrolytes I and to 60 A/dm2 in electrolytes II. This corresponds to the metal deposition rates to 23 and 48 A/dm2, respectively. It is shown experimentally that high buffer properties of solutions (succinate buffer) are one of the reasons for high permissible current densities of nickel electrodeposition. The computer-calculated data showed that the intensification of nickel electrodeposition is caused also by the acceleration of mass transfer due to the presence of a considerable fraction of nickel in the form of positively charged complexes and a high concentration of components stabilizing pHS in the near-cathode layer.

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Authors and Affiliations

  1. Mendeleev University of Chemical Technology, Miusskaya pl. 9, Moscow, 125047, Russia

    A. A. Sedoikin & T. E. Tsupak

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  1. A. A. Sedoikin
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  2. T. E. Tsupak
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Correspondence to T. E. Tsupak.

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Original Russian Text © A.A. Sedoikin, T.E. Tsupak, 2008, published in Elektrokhimiya, 2008, Vol. 44, No. 3, pp. 343–350.

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Sedoikin, A.A., Tsupak, T.E. The role of migration mass transfer in the electrodeposition of nickel from sulfate-chloride and chloride solutions containing succinic acid. Russ J Electrochem 44, 319–326 (2008). https://doi.org/10.1134/S1023193508030099

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