Abstract
Ni–8 at % W alloy ingots were prepared using a spark plasma sintering technique. The evolution of the microstructure, cold-rolling texture, and recrystallization texture of the Ni8W alloy were studied using X-ray diffractometry and electron backscatter diffractometry techniques. The results revealed the strong influence of the initial grain size on the cube texture formation of the annealed substrates. A strong cube texture was obtained in substrates with finer initial grains. A brass-type rolling texture was formed in the final cold-rolled tape after cold rolling. The cold-rolled tape mainly consisted of S, brass, and a weak {110} 〈118〉 texture. The cube orientation nuclei did not have a nucleation advantage at the early stage of recrystallization. Large-scale twinning was exhibited in the cold-rolled microstructure at a high annealing temperature. The cube orientation and RD (rolling direction)-cube orientation textures, which transformed from the cube twin orientation and random orientation grains, were grown immediately at almost the same rate. The cube orientation and RD-cube orientation grains grew faster than other orientation grains throughout the whole grain growth process. Finally, a strong cube texture was obtained for the Ni–8 at % W substrate after an optimized annealing process.
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Funding
This work was suported by the National Natural Science Foundation of China (51702316, 51807191 and 11745005), the General Program of Science and Technology Development Project of Beijing Municipal Education Commission of China (KM201810005010), 211 Program of Beijing City and Beijing University of Technology, and the Program of Top Disciplines Construction in Beijing (PXM2019_014204_500031) and the International Partnership Program of the Chinese Academy of Sciences (182111KYSB20170039), Youth Innovation Promotion Association of the Chinese Academy of Sciences (2020143).
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Yaotang Ji, Suo, H., Meng, Y. et al. A Study about Ni–8 at % W Alloy Substrates Used for REBCO Coated Conductors. Phys. Metals Metallogr. 122, 1473–1481 (2021). https://doi.org/10.1134/S0031918X21140118
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DOI: https://doi.org/10.1134/S0031918X21140118