Abstract
A two-component organosilicon composition was developed based on a solution of linear ladder organosilicon block copolymers containing linear polyorganosiloxane and ladder phenylsilsesquioxane units in an organic solvent and a curing agent, vinyl-tris-(acetoximo)silane. The composition can be used for the preparation of heat-resistant flexible and strong electroinsulating corrosion-passive coatings that serve to protect active components of micro- and radioelectronic products from effects of severe climatic factors.
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Translated by K. Utegenov
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Neelova, O.V., Panova, T.A., Gazzaeva, R.A. et al. An Organosilicon Composition for Protection of Active Components of Electronic Products. Polym. Sci. Ser. D 12, 345–350 (2019). https://doi.org/10.1134/S1995421219040105
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DOI: https://doi.org/10.1134/S1995421219040105