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Dielectric Barrier in the Subtractive Process of Formation of a Copper Metallization System

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Abstract

This article studies various methods for the formation of dielectric diffusion barriers between open areas of copper and an organosilicate low-k dielectric in the subtractive method of forming a metallization system, in which metal lines are first formed, and then a low-k dielectric is deposited. Films of dense and porous organosilicate glass deposited by chemical deposition from solutions are used as a low-k dielectric. A comparison is made between AlN barrier layers formed by atomic layer deposition and SiCN barriers deposited by plasma-assisted chemical vapor deposition. The successful formation of a model structure of copper metallization using AlN barriers is demonstrated.

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Funding

This study was supported by grant nos. 18-29-27024 and 18-29-27022 of the Russian Foundation for Basic Research.

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Authors and Affiliations

  1. AO Research Institute of Molecular Electronics, 124460, Zelenograd, Moscow, Russia

    A. A. Orlov, A. A. Rezvanov, V. A. Gvozdev & P. I. Kuznetsov

  2. Moscow Institute of Physics and Technology (National Research University), 141701, Dolgoprudnyi, Russia

    A. A. Orlov & A. A. Rezvanov

  3. MIREA–Russian Technological University, 119454, Moscow, Russia

    G. A. Orlov, D. S. Seregin & K. A. Vorotilov

  4. Picosun Oy, Masalantie 365, FI-02430, Masala, Finland

    T. Blumberg, A. A. Veselov & T. Suzuki

  5. PAO Mikron, 124460, Zelenograd, Moscow, Russia

    E. N. Morozov

Authors
  1. A. A. Orlov
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  2. A. A. Rezvanov
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  3. V. A. Gvozdev
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  4. G. A. Orlov
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  6. P. I. Kuznetsov
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  7. T. Blumberg
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  8. A. A. Veselov
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  9. T. Suzuki
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  10. E. N. Morozov
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  11. K. A. Vorotilov
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Correspondence to A. A. Orlov.

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Translated by S. Rostovtseva

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Orlov, A.A., Rezvanov, A.A., Gvozdev, V.A. et al. Dielectric Barrier in the Subtractive Process of Formation of a Copper Metallization System. Russ Microelectron 51, 470–479 (2022). https://doi.org/10.1134/S106373972270010X

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  • DOI: https://doi.org/10.1134/S106373972270010X

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