Abstract
It is demonstrated that plasma techniques can be used to detect various defects on a solid surface by a self-sustained discharge under atmospheric pressure. Special attention is paid to controlling surface defects and the end cleavages of semiconducting wafers and pinholes of layered structures.
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Original Russian Text © D.V. Sitanov, S.A. Pivovarenok, 2018, published in Mikroelektronika, 2018, Vol. 47, No. 1.
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Sitanov, D.V., Pivovarenok, S.A. Visualization of Defects on the Semiconductor Surface Using a Dielectric Barrier Discharge. Russ Microelectron 47, 34–39 (2018). https://doi.org/10.1134/S1063739718010067
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DOI: https://doi.org/10.1134/S1063739718010067