Enhanced thermal conductivity of novel multifunctional polyphenylene sulfide composites embedded with heat transfer networks of hybrid fillers

Siu N. Leung; Omer M. Khan; Ellen Chan; Hani E. Naguib; Francis Dawson; Vincent Adinkrah; Laszlo Lakatos-Hayward

doi:10.1117/12.881896

28 April 2011 Enhanced thermal conductivity of novel multifunctional polyphenylene sulfide composites embedded with heat transfer networks of hybrid fillers

Siu N. Leung, Omer M. Khan, Ellen Chan, Hani E. Naguib, Francis Dawson, Vincent Adinkrah, Laszlo Lakatos-Hayward

Author Affiliations +

Proceedings Volume 7978, Behavior and Mechanics of Multifunctional Materials and Composites 2011; 79780V (2011) https://doi.org/10.1117/12.881896
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2011, San Diego, California, United States

Abstract

Today's smaller, more powerful electronic devices, communications equipment, and lighting apparatus required optimum heat dissipation solutions. Traditionally, metals are widely known for their superior thermal conductivity; however, their good electrical conductivity has limited their applications in heat management components for microelectronic applications. This prompts the requirement to develop novel plastic composites that satisfy multifunctional requirements thermally, electrically, and mechanically. Furthermore, the moldability of polymer composites would make them ideal for manufacturing three-dimensional, net-shape enclosures and/or heat management assembly. Using polyphenylene sulfide (PPS) as the matrix, heat transfer networks were developed and structured by embedding hexagonal boron nitride (BN) alone, blending BN fillers of different shapes and sizes, as well as hybridizing BN fillers with carbonaceous nano- and micro-fillers. Parametric studies were conducted to elucidate the effects of types, shapes, sizes, and hybridization of fillers on the composite's thermal and electrical properties. The use of hybrid fillers, with optimized material formulations, was found to effectively promote a composite's thermal conductivity. This was achieved by optimizing the development of an interconnected thermal conductive network through structuring hybrid fillers with appropriate shapes and sizes. The thermal conductive composite affords unique opportunities to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.

Citation Download Citation

Siu N. Leung, Omer M. Khan, Ellen Chan, Hani E. Naguib, Francis Dawson, Vincent Adinkrah, and Laszlo Lakatos-Hayward "Enhanced thermal conductivity of novel multifunctional polyphenylene sulfide composites embedded with heat transfer networks of hybrid fillers", Proc. SPIE 7978, Behavior and Mechanics of Multifunctional Materials and Composites 2011, 79780V (28 April 2011); https://doi.org/10.1117/12.881896

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