Systematic failure debug and defective pattern extraction for FPGA product yield improvement

Cinti Chen; Joe W. Zhao; Ping Zhang; Raymond Y. Xu

doi:10.1117/12.848185

2 April 2010 Systematic failure debug and defective pattern extraction for FPGA product yield improvement

Cinti Chen, Joe W. Zhao, Ping Zhang, Raymond Y. Xu

Proceedings Volume 7641, Design for Manufacturability through Design-Process Integration IV; 76410C (2010) https://doi.org/10.1117/12.848185
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

In this paper, we have presented an effective yield improvement methodology that can help both manufacturing foundries, fabless and fab-lite companies to identify systematic failures. It uses the physical addresses of failing bits from wafer sort results to overlay to inline wafer defect inspection locations. The inline defect patterns or the design patterns where overlay results showed matches were extracted and grouped by feature similarity or cell names. The potentially problematic design patterns can be obtained and used for design debug and process improvement.

Citation Download Citation

Cinti Chen, Joe W. Zhao, Ping Zhang, and Raymond Y. Xu "Systematic failure debug and defective pattern extraction for FPGA product yield improvement", Proc. SPIE 7641, Design for Manufacturability through Design-Process Integration IV, 76410C (2 April 2010); https://doi.org/10.1117/12.848185

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