Paper
27 March 2009 Effect of bending on the performance of spool-packaged shape memory alloy actuators
Author Affiliations +
Abstract
Shape memory alloy (SMA) actuation is becoming an increasingly viable technology for industrial applications as many of the technical issues that have limited its use are being addressed (speed of actuation, mechanical connections, performance degradation, quality control, etc.) while increasing production capacities drive costs to practical levels. Shape memory alloys are often selected because of their high energy density which can lead to compact actuators; however, wire forms with small cross-sectional diameters tend to be long (10 to 50 times the length of required stroke). Spooling the wire can be used for compact packaging, but as the spool diameter decreases performance losses and fatigue increase due to bending strains and stresses. This paper presents a simple, design-level model for spooled SMA wire actuators with linear motion outputs that includes the effects of friction and wire bending and accounts for the actuator geometry, applied load, and material friction and constitutive properties. The model was validated experimentally with respect to the ratio of mandrel to SMA wire diameter and agrees well in both form and magnitude with experiments. The resulting model provides the framework for the analysis and synthesis of spooled SMA wire actuators to guide the selection of design parameters with respect to the tradeoffs between performance and packaging.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John A. Redmond, Diann Brei, Jonathan Luntz, Alan L. Browne, and Nancy L. Johnson "Effect of bending on the performance of spool-packaged shape memory alloy actuators", Proc. SPIE 7290, Industrial and Commercial Applications of Smart Structures Technologies 2009, 729007 (27 March 2009); https://doi.org/10.1117/12.816666
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Shape memory alloys

Actuators

Motion models

Data modeling

Nano opto mechanical systems

Packaging

Performance modeling

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