Plastic thermally controllable platform with integrated thin film microcomponents

Dae-Sik Lee; Kwang-Hyo Chung; Haesik Yang; Se Ho Park; Sung-Jin Kim; Hyun-Bong Pyo

doi:10.1117/12.582342

23 February 2005 Plastic thermally controllable platform with integrated thin film microcomponents

Dae-Sik Lee, Kwang-Hyo Chung, Haesik Yang, Se Ho Park, Sung-Jin Kim, Hyun-Bong Pyo

Proceedings Volume 5650, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II; (2005) https://doi.org/10.1117/12.582342
Event: Smart Materials, Nano-, and Micro-Smart Systems, 2004, Sydney, Australia

Abstract

We present a novel technology for a cyclo-olefin-copolymer (COC) plastic microfluidic platform for heat control with fully semiconductor process-compatible photolithographic 5 μm-wide metal patterns, for heaters, electrodes, and temperature sensors and a thin membrane structure. Through tests of compatibility of some thermoplastic materials with chemical solutions and temperature tolerance to the semiconductor processes (thin film depositions, photolithography, and etchings), we selected COC as a semiconductor process-compatible plastic material for biomedical applications. For photolithography processes, we manufactured the 5’ COC wafer with flat surface with c.a. 3 nm surface roughness, employing a novel flame-torched injection-molding method. Furthermore, the part of heating blocks on COC wafers is controlled thickness to the 100 μm, to enhance the heat-ramping speeds through reduction of the thermal mass. In order to fabricate the Au thin film micro-patterns for temperature sensors, heaters, and electrodes, Au film (100 nm) was deposited by e-beam evaporator and patterned by using standard photolithography, and wet-etched. The micro-patterned Au temperature sensors, heaters, and electrodes was demonstrated. For insulating layers, Al₂O₃ film was deposited by an ALD system, patterned by using the standard photolithography, and wet-etched. Using the COC microfluidic platform, we tested thermal cycling with simple heating and natural cooling on chip with water and, heating rates (5°C/s when heating, 3°C/s when cooling) are obtained. Therefore, the COC microfluidic platform can be applied to a DNA lab-on-a-chip.

Citation Download Citation

Dae-Sik Lee, Kwang-Hyo Chung, Haesik Yang, Se Ho Park, Sung-Jin Kim, and Hyun-Bong Pyo "Plastic thermally controllable platform with integrated thin film microcomponents", Proc. SPIE 5650, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, (23 February 2005); https://doi.org/10.1117/12.582342

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available