On-product overlay improvement with an enhanced alignment system

Tomonori Dosho; Yuji Shiba; Takanobu Okamoto; Hajime Yamamoto; Yujiro Hikida; Jay Brown; Go Ichinose; Masahiro Morita; Yuichi Shibazaki

doi:10.1117/12.2257659

24 March 2017 On-product overlay improvement with an enhanced alignment system

Tomonori Dosho, Yuji Shiba, Takanobu Okamoto, Hajime Yamamoto, Yujiro Hikida, Jay Brown, Go Ichinose, Masahiro Morita, Yuichi Shibazaki

Author Affiliations +

Proceedings Volume 10147, Optical Microlithography XXX; 1014716 (2017) https://doi.org/10.1117/12.2257659
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

The final lithography accuracy is determined by what is known as the “on-product” performance, which includes product wafer-related errors and long-term stability. It is evident that on-product performance improvement is absolutely imperative now, and will become even more crucial in coming years. In order to meet customers’ future requirements, we have developed the next-generation lithography system focusing on wafer alignment advancements to improve onproduct performance.

This newly developed wafer alignment system will help customers achieve their aggressive next-generation manufacturing accuracy and productivity requirements. In this paper, we describe the details of the new wafer measurement system and provide supporting performance data.

Citation Download Citation

Tomonori Dosho, Yuji Shiba, Takanobu Okamoto, Hajime Yamamoto, Yujiro Hikida, Jay Brown, Go Ichinose, Masahiro Morita, and Yuichi Shibazaki "On-product overlay improvement with an enhanced alignment system", Proc. SPIE 10147, Optical Microlithography XXX, 1014716 (24 March 2017); https://doi.org/10.1117/12.2257659

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