1st European Union/United States Lead-Free Solder Interface Meeting

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2002

49

Keywords

Citation

(2002), "1st European Union/United States Lead-Free Solder Interface Meeting", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bab.012

Publisher

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Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited


1st European Union/United States Lead-Free Solder Interface Meeting

Keywords: Lead-free solder, Meetings

The first EU/US interface meeting on lead-free technology was held at the American Embassy, 24 Grosvenor Square, London, UK, March 27th, 2002.

Aim of Meeting

The aim of the meeting, which was principally a US initiative, promoted by U.S. aerospace companies & organisations, was to seek a lead- free working partnership with EU companies & organisations, under JG-PP, the Joint Group on Pollution Prevention, which includes US Dept of Defence and NASA.

Speakers & papers presented, photo from left to right:

Richard E. Pinckert, Director of Design Integration & Environmental Assurance The Boeing Company, USA.Boeing's Lead-Free Solder Efforts

GEN Pelagio Castelo Branco, PresidentAssociacao Danotec, Portugal.A European Defence Industry Perspective

Barry M. Braden, Deputy Associate Director, Spaceport Technology PMO, NASA, National Aeronautics and Space Administration, USA.Exchange on EU-US efforts in lead-free solder technology, Identify partnerships

Lee Whiteman, Senior Manufacturing Engineer & Principal Investigator American Competitiveness Institute, USA.Initiative in Lead-Free Solder, Manufacturing & Industry Feedback

Robert P. Hill, Vice President & COO ITB. Inc, USA & NASA Program IntegratorOverview of Joint Group on Pollution Prevention Program & Project Methodology

Ruben Bergman, Executive Director HDP, High Density Packaging, User Group, USA & Chairman, Global Environmental Coordination Initiative.General Purpose Lead-Free Assembly, The HDP User Group & GECI views

Clive Simmonds, Manufacturing Engineering Manager BAE Systems, UK.Lead-Free Solder, Manufacturing Experience & Industry Feedback

Kay Nimmo, Director, Research and DevelopmentSoldertec at Tin Technology.Lead-Free in Europe: Legislation, Technology Roadmap & Research

Dr F. Michael Pestorius, Technical Director, U.S Office of Naval Research, International Field Office, based in U.K.Welcome & overview

Norman R Stockham, Business Development manager, Electronics & Sensors, TWI Ltd, U.K.TWI's Experience of Lead-Free Soldering, Issues & Non Solder Options

Rick CiocciCALCE, Electronics Product and Systems Centre.US Research Institution Roadmap for the Migration to Lead-Free Electronics

Eduardo Manual Dias Lopes, Director,Instituto De Sodara E Qualidade, Portugal.ISQ's Experience with Lead-Free Solder

At the conclusion to the day, Robert P Hill requested that any attendees interested in joining this JG-PP Initiative should respond within three weeks.

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