IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2001

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Citation

(2001), "IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bab.005

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin

IMAPS USA

"Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin

IMAPS' Conference and Exhibition on Flip Chip Technology will bring everything from the basics to actual implementation to hot issues such as PB-free solder bumping to the forefront from 18-20 June 2001, at the Four Seasons Hotel, Austin, Texas. Sponsored by IMAPS, in conjunction with the Central Texas Electronic Association (CTEA), this first annual Conference, which includes a comprehensive Topical Workshop (TW) on Flip Chip Technology, will feature Technical Sessions on topics that include: Assembly, Reliability, Underfill technology, Bumping and interconnect, PB-Free Flip Chips, and Modeling. Also included are Professional Development Courses scheduled for Monday 18 June, that include "Flip Chip Technology: bumping, PWBs, assembly and reliability"; and "Known good die technologies for flip chip". In addition, 70 exhibitors are expected to display their products, showing the latest advances in Flip Chip Technology.

The technical program will focus on recent advances in flip chip technology as well as implementation issues. In addition, the local chapter will host a tabletop exhibition that will be included with the workshop to allow attendees to see the latest products and services available from suppliers who support the use of flip chip technology. Conference and events will be held 18-20 June 2001; Tabletop exhibits will be on display 18-19 June 2001.

The expanded Flip Chip Conference and Exhibition is an outgrowth of the highly successful IMAPS Flip Chip Advanced Technology Workshop. An aggressive growth rate of 28.5 percent per year is expected to bring the flip chip market to about 2.5 billion die in 2002.

Further details: Technical Program, Jackki Morris, jmorris@imaps.org; Registration, Angie Johnson, ajohnson@imaps.org; Exhibits, Ann Bell, abell@imaps.org

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