TechSearch International analyzes market surge in high density interconnect flex circuits

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2001

46

Keywords

Citation

(2001), "TechSearch International analyzes market surge in high density interconnect flex circuits", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aaf.002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


TechSearch International analyzes market surge in high density interconnect flex circuits

TechSearch International analyzes market surge in high density interconnect flex circuits

Keywords: Flexible circuits, Market trends

TechSearch International's new study, "Flexible circuits for high density applications", investigates the growing market for high density interconnect (HDI) flex circuit. HDI flex is defined as circuits with less than 200µm pitch and/or via diameters of less than 250µm. Applications for HDI flex include IC package substrates such as chip scale packages (CSPs) and ball grid arrays (BGAs); consumer products such as cameras and camcorders; mobile phones, computer, and computer peripherals such as disk drives and ink jet printers; medical products such as hearing aids, defibrillators, and ultrasound equipment; and liquid crystal display (LCD) modules. While demand for flex circuit is growing dramatically in a wide range of applications including automotive, computers, telecommunications, and industrial, the dollar value growth in the HDI segment is even greater. The study provides a market forecast in volume (square meters) and by dollar value for each HDI flex application area.

Shrinking feature sizes are the trend for flex circuit (also known as TAB tape) used in applications such as LCD drivers, CSPs, and BGAs. Lines and spaces for some of these products are 35µm or less. Circuits with two metal layers used in IC packages now require 25µm vias. Feature sizes for HDI flex applications range from medical products with 50µm lines and spaces and 50µm vias with 100µm capture pads, to ink jet printer cartridges with 75µm lines and spaces. With increased product miniaturization and the growing use of implantable devices, feature sizes will continue to shrink for medical applications.

Unlike many flex circuit reports, this analysis includes both TAB tape and traditional flex circuit manufacturers. Despite their common material properties, construction, and fabrication methods, tape and flex manufacturers typically have been considered separate industry segments. With many suppliers targeting the same applications, boundary distinctions are blurring and competition is expected to increase.

Flex circuit producers are located in many regions of the world – North America, Japan, Taiwan, Hong Kong, China, and Europe. Highlighted in this report are 54 suppliers of flex circuit including two dozen TAB tape suppliers. Also included is an appendix with more than 110 contacts for flex circuit suppliers worldwide and more than two dozen IC package contract assembly operations offering CSP and BGA assembly services using flex circuit or TAB tape.

The study also analyzes the production of key materials such as photoimageable coverlay and adhesiveless laminates – key to HDI flex market expansion. More than ten companies have commercialized adhesiveless clad laminates for HDI flex circuit in the last decade and the market is expected to grow. This analysis features a discussion of material capacity and major suppliers as well as technology developments in the fabrication of high density flex circuit.

Further details: Jan Vardaman. Tel: +1 (512) 372-8887; E-mail: tsi@techsearchinc.com

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