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Alternative Solders for Electronics Assemblies: Part 2: UK Progress and Preliminary Trials

J.H. Vincent (GEC‐Marconi Ltd, Hirst Research Centre, Wembley, Middlesex, England)
B.P. Richards (GEC‐Marconi Ltd, Hirst Research Centre, Wembley, Middlesex, England)
D.R. Wallis (GEC‐Marconi Ltd, Hirst Research Centre, Wembley, Middlesex, England)
I.A. Gunter (GEC‐Marconi Ltd, Hirst Research Centre, Wembley, Middlesex, England)
M. Warwick (Multicore Solders Ltd, Hemel Hempstead, Hertfordshire, England)
H.A.H. Steen (Multicore Solders Ltd, Hemel Hempstead, Hertfordshire, England)
P.G. Harris (International Tin Research Institute, Uxbridge, Middlesex, England)
M.A. Whitmore (International Tin Research Institute, Uxbridge, Middlesex, England)
S.R. Billington (BNR (Europe) Ltd, England)
A.C. Harman (BNR (Europe) Ltd, England)
E. Knight (BNR (Europe) Ltd, England)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1993

71

Abstract

This is the second of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the above companies and research centres. The objectives of the programme are to identify/develop lead‐free alternatives to Sn‐40Pb solder, progress towards the development of which is described in this paper. A number of promising alloys have been selected for trial in a further round of experimentation.

Citation

Vincent, J.H., Richards, B.P., Wallis, D.R., Gunter, I.A., Warwick, M., Steen, H.A.H., Harris, P.G., Whitmore, M.A., Billington, S.R., Harman, A.C. and Knight, E. (1993), "Alternative Solders for Electronics Assemblies: Part 2: UK Progress and Preliminary Trials", Circuit World, Vol. 19 No. 3, pp. 32-34. https://doi.org/10.1108/eb046210

Publisher

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MCB UP Ltd

Copyright © 1993, MCB UP Limited

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