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Open trace defects in FR4 printed circuit boards

Sanka Ganesan (CALCE Electronics Products System Center, University of Maryland, College Park, Maryland, USA)
Michael Pecht (CALCE Electronics Products System Center, University of Maryland, College Park, Maryland, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 2006

3578

Abstract

Purpose

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To present and discuss open trace defects uncovered in an FR4 assembly during electrical testing.

Design/methodology/approach

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This paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper also discusses possible root causes for their occurrence.

Findings

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The open trace defects that occurred during printed circuit board (PCB) fabrication should have been observed by the board manufacturer. It appears that the PCB manufacturer did not perform automatic optical inspection (AOI) and electrical testing during the manufacturing of the boards. The cost due to the rejected PCBAs was approximately 3x times that of the PCB cost.

Originality/value

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The paper highlights the costly impact of uncovering a PCB defect after assembly. Based on the results of this study, the implementation of electrical testing and AOI for PCBs is recommended.

Keywords

Citation

Ganesan, S. and Pecht, M. (2006), "Open trace defects in FR4 printed circuit boards", Circuit World, Vol. 32 No. 1, pp. 3-7. https://doi.org/10.1108/03056120610616490

Publisher

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Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited

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