Exponential behavior of the Ohmic transport in organic films

Corneliu N. Colesniuc, Rudro R. Biswas, Samuel A. Hevia, Alexander V. Balatsky, and Ivan K. Schuller
Phys. Rev. B 83, 085414 – Published 18 February 2011

Abstract

An exponential dependence of conductance on thickness and temperature was found in the low-voltage, Ohmic regime of copper (CuPc) and cobalt (CoPc) phthalocyanine, sandwiched between palladium and gold electrodes unlike ever claimed in organic materials. To assure cleanliness and integrity of the electrode-phthalocyanine interface, the devices were prepared in situ, using organic molecular beam deposition with a floating shadow mask. The dc transport measurements in a wide temperature and thickness range show that (i) the low-voltage J-V curve is linear, with current increasing sharply at higher voltages, (ii) the low-voltage conductance increases exponentially with temperature, and (iii) it decreases exponentially with film thickness. A comparison with conventional models fails to explain all the data with a single set of parameters. On the other hand, a model outlined here, which incorporates tunneling between localized states with thermally induced overlap, agrees with the data and decouples the contributions to conductance from the electrode-film interface and the bulk of the film.

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  • Received 3 October 2010

DOI:https://doi.org/10.1103/PhysRevB.83.085414

©2011 American Physical Society

Authors & Affiliations

Corneliu N. Colesniuc1,*, Rudro R. Biswas2, Samuel A. Hevia1,3, Alexander V. Balatsky4, and Ivan K. Schuller1

  • 1Department of Physics and Center for Advanced Nanotechnology, University of California San Diego, La Jolla, California 92093, USA
  • 2Department of Physics, Harvard University, Cambridge, Massachusetts 02138, USA
  • 3Facultad de Física, Universidad Católica de Chile, Casilla 306, Santiago, Chile 6904411
  • 4Theoretical Division and Center for Integrated Nano-Technologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA

  • *ccoles@physics.ucsd.edu

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Issue

Vol. 83, Iss. 8 — 15 February 2011

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