Lattice strain and band overlap of the thermoelectric composite Mg2Si1xSnx

Wenliang Yao, Shunbo Hu, Fanhao Jia, Jeffrey R. Reimers, Yin Wang, David J. Singh, and Wei Ren
Phys. Rev. B 106, 104303 – Published 13 September 2022
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Abstract

Mg2Si1xSnx solid solutions show enhanced thermoelectric performance when the Sn mole fraction x is approximately x=0.7. This has been discussed in terms of complexity of the electronic structure arising from the crossover of two bottom conduction bands, but direct detailed understanding of the origins and the precise nature of this band convergence is limited. Here, we report first-principles calculations of the band edge changes analyzed by band unfolding and crystal orbital Hamilton population techniques. We find that strain is particularly important at this crossing. Mg2Si and Mg2Sn show opposite trends in the conduction band edge shifts leading to a band crossover at x0.625. However, there are also important effects due to disorder. Transport calculations show that enhancement of the figure of merit ZT value owes to the combined effects of lattice strain, band edge overlap, composition change, and disorder.

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  • Received 4 March 2022
  • Revised 14 August 2022
  • Accepted 25 August 2022

DOI:https://doi.org/10.1103/PhysRevB.106.104303

©2022 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Wenliang Yao1, Shunbo Hu1,2,*, Fanhao Jia1,2,†, Jeffrey R. Reimers1,3, Yin Wang1, David J. Singh4, and Wei Ren1,2,‡

  • 1Physics Department, International Center for Quantum and Molecular Structures, Materials Genome Institute, Shanghai University, Shanghai 200444, China
  • 2Zhejiang Laboratory, Hangzhou 311100, China
  • 3University of Technology Sydney, School of Mathematical and Physical Sciences, Ultimo, New South Wales 2007, Australia
  • 4Department of Physics and Astronomy, University of Missouri, Columbia, Missouri 65211, USA

  • *shunbohu@shu.edu.cn
  • fanhaojia@shu.edu.cn
  • renwei@shu.edu.cn

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Issue

Vol. 106, Iss. 10 — 1 September 2022

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