Extended state reshaping in non-Hermitian topolectrical circuits

Chao Liu, Banxian Ruan, Weipeng Hu, Wei Lin, Xiaoyu Dai, Jien Wu, Leyong Jiang, and Yuanjiang Xiang
Phys. Rev. Applied 21, 054013 – Published 6 May 2024

Abstract

Topological modes in the bandgap are generally localized at the boundaries. However, recent research proposes a new topological mode arising from the non-Hermitian skin effect, whose energy can extend to the bulk, forming the topological extended state. Such a topological mode can increase the space utilization of topological devices, which is worth further exploration and confirmation in classical systems. Here, we propose a topological extended state reshaping in non-Hermitian topolectrical circuits with a skin effect, where the stairlike extended mode is reshaped by controlling the odd-even properties of unit cells in the electric circuit ring. The extended state reshaping is confirmed by measuring the stairlike voltage distribution in the experiment. Our finding enriches the characteristics of extended states, and has potential application in multichannel tunable topological devices based on the stairlike extended mode.

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  • Received 7 January 2024
  • Revised 29 March 2024
  • Accepted 15 April 2024

DOI:https://doi.org/10.1103/PhysRevApplied.21.054013

© 2024 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Chao Liu1,2, Banxian Ruan1, Weipeng Hu1, Wei Lin1, Xiaoyu Dai1, Jien Wu3,*, Leyong Jiang4,†, and Yuanjiang Xiang1,‡

  • 1School of Physics and Electronics, Hunan University, Changsha 410082, China
  • 2School of Information Science and Engineering, Hunan Institute of Science and Technology, Yueyang, 414006, China
  • 3School of Physics and Optoelectronics, South China University of Technology, Guangdong 510640, China
  • 4School of Physics and Electronics, Hunan Normal University, Changsha 410081, China

  • *Corresponding author: wje@scut.edu.cn
  • Corresponding author: jiangly28@hunnu.edu.cn
  • Corresponding author: xiangyuanjiang@126.com

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Vol. 21, Iss. 5 — May 2024

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