Patterning Colloidal Films via Evaporative Lithography

Daniel J. Harris, Hua Hu, Jacinta C. Conrad, and Jennifer A. Lewis
Phys. Rev. Lett. 98, 148301 – Published 5 April 2007
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Abstract

We investigate evaporative lithography as a route for patterning colloidal films. Films are dried beneath a mask that induces periodic variations between regions of free and hindered evaporation. Direct imaging reveals that particles segregate laterally within the film, as fluid and entrained particles migrate towards regions of higher evaporative flux. The films exhibit remarkable pattern formation that can be regulated by tuning the initial suspension composition, separation distance between the mask and underlying film, and mask geometry.

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  • Received 19 December 2006

DOI:https://doi.org/10.1103/PhysRevLett.98.148301

©2007 American Physical Society

Authors & Affiliations

Daniel J. Harris1, Hua Hu2, Jacinta C. Conrad1,3, and Jennifer A. Lewis1,*

  • 1Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
  • 2Corporate Engineering Technical Lab, The Procter and Gamble Company, West Chester, Ohio 45069, USA
  • 3INEST Group Postgraduate Program, Philip Morris USA, Richmond, Virginia 23234, USA

  • *Electronic address: jalewis@uiuc.edu

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Issue

Vol. 98, Iss. 14 — 6 April 2007

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