Dielectric function of a-Si:H based on local network structures

Shota Kageyama, Masataka Akagawa, and Hiroyuki Fujiwara
Phys. Rev. B 83, 195205 – Published 5 May 2011

Abstract

For hydrogenated amorphous silicon (a-Si:H) layers prepared by plasma-enhanced chemical vapor deposition, we have found clear relationships between the dielectric function in the ultraviolet/visible region and SiHn (n = 1–2) local bonding states by applying real-time spectroscopic ellipsometry and infrared attenuated total reflection spectroscopy. In particular, the amplitude of the ɛ2 spectra obtained from various a-Si:H layers is expressed completely by the SiH2 bond density in the a-Si:H and reduces strongly with increasing the SiH2 content, indicating that microvoids present in the a-Si:H network are surrounded by the SiH2 bonding state. On the other hand, no significant void formation occurs by the generation of the SiH local bonding due to rather dense surrounding structures. Depending on the SiHn bonding states, the whole a-Si:H dielectric function shifts toward higher energies, as the SiHn hydrogen contents in the a-Si:H increase. Based on these findings, we have established a new a-Si:H dielectric function model that incorporates the void structure terminated with SiH2 and ɛ2 spectral shift induced by the SiHn local structures. This model is appropriate for a wide variety of a-Si:H layers deposited at different substrate temperatures and plasma conditions and, conversely, allows the characterization of the SiHn contents from the a-Si:H dielectric functions in the ultraviolet/visible region. From results obtained in this study, the local network structures and electronic states of a-Si:H are discussed.

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  • Received 16 December 2010

DOI:https://doi.org/10.1103/PhysRevB.83.195205

©2011 American Physical Society

Authors & Affiliations

Shota Kageyama, Masataka Akagawa, and Hiroyuki Fujiwara*

  • Center of Innovative Photovoltaic Systems (CIPS), Gifu University, 1-1 Yanagido, Gifu 501-1193, Japan

  • *fujiwara@gifu-u.ac.jp

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Issue

Vol. 83, Iss. 19 — 15 May 2011

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