Gigahertz Phononic Integrated Circuits Based on Overlay Slot Waveguides

Ziyao Feng, Yang Liu, Xiang Xi, Lai Wang, and Xiankai Sun
Phys. Rev. Applied 19, 064076 – Published 27 June 2023
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Abstract

Harnessing the properties of phonons on a chip, phononic integrated circuits are playing an increasingly important role in optoelectronic integration. To date, most of such phononic waveguides are realized by etching a piezoelectric layer and forming a wire, which not only involves complicated fabrication processes but also limits integration with electronic and photonic elements on the same chip. To overcome these difficulties, here we propose and demonstrate a type of overlay slot phononic waveguide obtained by patterning a thin silicon cladding layer on an unetched gallium-nitride-on-sapphire substrate. We experimentally demonstrate the guiding and power splitting of gigahertz surface acoustic waves in such waveguides, with a measured propagation loss of about 1.80 dB/mm for the Rayleigh mode. We also theoretically predict that the Love mode in such waveguides can turn into a phononic bound state in the continuum under special conditions. Such waveguides introduce an alternative paradigm for phononic integrated circuitry and will enable applications in information processing, environmental monitoring, and noninvasive manipulation of biomolecules on a chip.

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  • Received 31 October 2022
  • Revised 6 March 2023
  • Accepted 17 April 2023

DOI:https://doi.org/10.1103/PhysRevApplied.19.064076

© 2023 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Ziyao Feng1,†, Yang Liu2,†, Xiang Xi1, Lai Wang2, and Xiankai Sun1,*

  • 1Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong SAR, China
  • 2Beijing National Research Center for Information Science and Technology (BNRist), Department of Electronic Engineering, Tsinghua University, Beijing 100084, China

  • *xksun@cuhk.edu.hk
  • Z. Feng and Y. Liu contributed equally to this work.

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Issue

Vol. 19, Iss. 6 — June 2023

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