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Numerical Simulation of Thin Film Breakup on Nonwettable Surfaces

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Published under licence by IOP Publishing Ltd
, , Citation N Suzzi and G Croce 2017 J. Phys.: Conf. Ser. 796 012038 DOI 10.1088/1742-6596/796/1/012038

1742-6596/796/1/012038

Abstract

When a continuous film flows on a nonwettable substrate surface, it may break up, with the consequent formation of a dry-patch. The actual shape of the resulting water layer is of great interest in several engineering applications, from in-flight icing simulation to finned dehumidifier behavior modeling. Here, a 2D numerical solver for the prediction of film flow behavior is presented. The effect of the contact line is introduced via the disjoining pressure terms, and both gravity and shear are included in the formulation.

The code is validated with literature experimental data for the case of a stationary dry-patch on an inclined plane. Detailed numerical results are compared with literature simplified model prediction. Numerical simulation are then performed in order to predict the threshold value of the film thickness allowing for film breakup and to analyze the dependence of the dynamic contact angle on film velocity and position along the contact line. Those informations will be useful in order to efficiently predict more complex configuration involving multiple breakups on arbitrarily curved substrate surfaces (as those involved in in-flight icing phenomena on aircraft).

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10.1088/1742-6596/796/1/012038