Abstract
As the third-generation semiconductor material, GaN has the characteristics of large forbidden band width and high electron mobility. The AlGaN/GaN high electron mobility transistors (HEMTs) have also attracted attention in recent years. In this paper, the effect of self-heating on device degradation was explored through theoretical analysis and software simulation. Firstly, Silvaco TCAD was used to establish an AlGaN/GaN HEMT single heterojunction model. Then, its self-heating effect was explored by simulation. Besides, it was compared with the theoretical analysis results. The control experiment method was used to compare the I-V output characteristic curve of the device when the self-heating effect was considered, and the relationship between the lattice temperature and the device degradation was researched. According to the research result, when the device is affected by the self-heating effect, the electrical performance of the device degrades obviously due to the increase of lattice temperature.
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