We introduce a fracture mechanics concept of aging in solid dielectrics. The key element is that growth of a damage structure is only possible if the release of electrostatic energy due to growth exceeds the formation energy of the damage structure. Both the electrostatic energy release and the formation energy are calculated for simple examples.

1.
For reviews, see R. A. Fava, in Treatise on Materials Science and Technology, Vol. 10, edited by J. M. Schultz (Academic, New York, 1977);
R. M. Eichhorn, in Engineering Dielectrics, Vol. HA, edited by R. Bartnikas and R. M. Eichhorn (ASTM, Philadelphia, PA, 1983).
2.
J. Schirr, Thesis, Technical University Braunschweig, Germany (1974);
B.
Eilhardt
,
E.
Kindij
,
T.
Rummel
, and
H. O.
Stenzel
,
Elektrotechn. Z. A
92
,
138
(
1971
).
3.
A. C. Ashcraft, R. M. Eichhorn, and R. G. Shaw, IEEE International Symposium on Electrical Insulation Conference Record, p. 213 (1976) (unpublished).
4.
A. A.
Griffith
,
Phil. Trans. R. Soc. London Ser. A
221
,
163
(
1920
).
5.
C.
Laurent
,
C.
Mayoux
,
S.
Noel
, and
N. I.
Sonisuka
,
IEEE Trans. Electric. Insul.
EI‐18
,
125
(
1983
).
6.
K. D.
Wolter
,
J.
Tanaka
, and
J. F.
Johnson
,
IEEE Trans. Electric. Insul.
EI‐17
,
248
(
1982
);
C.
Mayoux
,
A.
Antoninou
,
Bui
Ai
and
R.
LaCoste
,
European Polym. J.
9
,
1069
(
1973
).
7.
M. Beyer, and G. Löffelmacher, in Internationals Hochspannungssymposium (ETH, Zürich, Switzerland, 1975).
8.
J. J. Ritsko, in Electronic Properties of Polymers, edited by J. Mort and G. Pfister (Wiley, New York, 1982).
9.
H. R. Zeller, P. Pfluger, and J. Bernasconi, IEEE Trans. Electric. Insul. (in press).
10.
A detailed version of the calculation is available from one of the authors (W. R. Schneider).
11.
O. Dorlanne, J. Andrianjohaninarivo, S. Paulin‐Dandurand, M. R. Wertheimer, and A. Yelon, Proceedings of the 1st International Conference on Conduction and Breakdown in Solid Dielectrics, Toulouse (1983), p. 236 (IEEE Service Center, Piscataway, N.J.)
This content is only available via PDF.
You do not currently have access to this content.