Issue 30, 2008
From the journal:

Journal of Materials Chemistry

The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing

Francisco Zaera*a  

* Corresponding authors

a Department of Chemistry, University of California, Riverside, CA, USA
E-mail: zaera@ucr.edu

Abstract

Atomic layer deposition (ALD) is poised to become one of the dominant technologies for the growth of nanometer-thick conformal films in microelectronics processing. ALD is particularly suited for the deposition of isotropic films on complex topographies under mild conditions and with monolayer control. However, many questions concerning the underlying surface chemistry need to be answered before this film deposition methodology can find widespread use. Here we highlight some recent examples of surface-science studies of ALD processes aimed to provide a basic understanding of that chemistry.

Graphical abstract: The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing

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Article information

DOI
https://doi.org/10.1039/B803832E
Article type
Highlight
Submitted
05 Mar 2008
Accepted
01 May 2008
First published
17 Jun 2008

J. Mater. Chem., 2008,18, 3521-3526

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The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing

F. Zaera, J. Mater. Chem., 2008, 18, 3521 DOI: 10.1039/B803832E

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