Scalable open-air deposition of compact ETL TiOx on perovskite for fullerene-free solar cells

Justin P. Chen; Florian Hilt; Nicholas Rolston; Reinhold H. Dauskardt

doi:10.1039/D0TA08554E

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Scalable open-air deposition of compact ETL TiO_x on perovskite for fullerene-free solar cells†

Justin P. Chen,

‡^a Florian Hilt,

‡§^a Nicholas Rolston^b and Reinhold H. Dauskardt

*^a

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* Corresponding authors

^a Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
E-mail: rhd@stanford.edu

^b Department of Applied Physics, Stanford University, Stanford, CA, USA

Abstract

We report a scalable, low-temperature TiO_x electron transport layer (ETL) produced directly on top of perovskite in an inverted architecture device by an open-air chemical vapor deposition (OA-CVD) process. The OA-CVD pyrolysis of a titanium ethoxide precursor forms a fully inorganic, conformal, and compact TiO_x film. The resultant film is mechanically robust and exhibits a fracture toughness 30-fold higher than commonly used fullerene-based ETL films. The TiO_x is an effective barrier layer against environmental degradation—unencapsulated devices with the TiO_x ETL retain 60% of their initial efficiency after 1000 hours in ambient aging conditions—compared to devices with a fullerene ETL which were inoperable after 144 hours. Inverted architecture devices with an optimized TiO_x ETL thickness of 70 nm exhibited high open-circuit voltages of 1.08 V. We comment on the photocatalytic properties of TiO_x and the influence of an amorphous film on maximum power point stability.

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DOI: https://doi.org/10.1039/D0TA08554E
Article type: Paper
Submitted: 01 Sep 2020
Accepted: 21 Oct 2020
First published: 28 Oct 2020

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J. Mater. Chem. A, 2020,8, 22858-22866

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Scalable open-air deposition of compact ETL TiO_x on perovskite for fullerene-free solar cells

J. P. Chen, F. Hilt, N. Rolston and R. H. Dauskardt, J. Mater. Chem. A, 2020, 8, 22858 DOI: 10.1039/D0TA08554E

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Journal of Materials Chemistry A