Investigation of the melt-growth process of YbBa2Cu3O7−δ powder in Ag-sheathed tapes

Zili Zhang; Jianyi Jiang; Hui Tian; Qiuliang Wang; David C. Larbalestier; Eric E. Hellstrom

doi:10.1039/C8CE02079E

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Investigation of the melt-growth process of YbBa₂Cu₃O_7−δ powder in Ag-sheathed tapes†

Zili Zhang,

^ab Jianyi Jiang,^a Hui Tian,^c Qiuliang Wang,*^b David C. Larbalestier^a and Eric E. Hellstrom*^a

Author affiliations

* Corresponding authors

^a Applied Superconductivity Center, National High Magnetic Field Laboratory, Florida State University, Tallahassee, FL 32310, USA
E-mail: hellstrom@asc.magnet.fsu.edu

^b Institute of Electrical Engineering, Chinese Academy of Sciences (CAS), Beijing 100190, China
E-mail: wongsm17@mail.iee.ac.cn

^c Key laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Thermal Engineering, Tsinghua University, Beijing, China

Abstract

We investigated the melt-growth behavior of YbBa₂Cu₃O_7−δ (Yb123) powder under different atmospheres for potential application in Ag-sheathed Yb123 wires. We chose Yb123 because it has the lowest melting temperature of the RE123 (RE = rare earth) phases. Yb123 needs to be melted under low oxygen partial pressure (pO₂) to depress its melt temperature below that of Ag. Here we report that adding Ag powder to Yb123 powder or encasing Yb123 powder in a Ag-sheath further decreases the melting temperature of Yb123. We designed a heat treatment process in which we varied the pO₂ during the heat treatment to melt the Yb123 in a Ag-sheathed powder-in-tube (PIT) wire and then regrow Yb123 on cooling. Based on these studies, we have developed a model for Yb123 melting and growth.

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Article information

DOI: https://doi.org/10.1039/C8CE02079E
Article type: Paper
Submitted: 07 Dec 2018
Accepted: 31 Jan 2019
First published: 01 Feb 2019

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CrystEngComm, 2019,21, 1369-1377

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Investigation of the melt-growth process of YbBa₂Cu₃O_7−δ powder in Ag-sheathed tapes

Z. Zhang, J. Jiang, H. Tian, Q. Wang, D. C. Larbalestier and E. E. Hellstrom, CrystEngComm, 2019, 21, 1369 DOI: 10.1039/C8CE02079E

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