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Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates

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Journal of Materials Science Letters

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References

  1. S. N. Burchett, M. K. Neilsen and D. R. Frear. Computational continuum modelling of solder interconnect, Applications, Advances in Electronic Packaging, ASME, p. 1523, 1997.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Brunel University, Uxbridge, IB8 3PH, UK

    B. Wang

  2. School of Mechanical and Production Engineering, Nanyang Technological University, Singapore, 639798

    S. Yi

Authors
  1. B. Wang
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  2. S. Yi
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Correspondence to B. Wang.

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Wang, B., Yi, S. Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates. Journal of Materials Science Letters 21, 697–698 (2002). https://doi.org/10.1023/A:1015776820115

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  • DOI: https://doi.org/10.1023/A:1015776820115

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