Abstract
Electroless NiP films, with 12 to 16 wt % P, were deposited from a moderately acid solution. Thermogravimetric analysis indicates the presence of occluded hydrogen in the layers, which desorbs upon heating. The amount of incorporated hydrogen decreases when the pH of the solution or the nickel sulfate concentration is increased; by contrast it increases with hypophosphite concentration. Cyclic voltammetry, using an electrochemical quartz crystal microbalance, confirms the existence of parasitic reactions, namely the reduction of protons of the solvent during the cathodic process and oxidation of hydrogen during the dissolution of the layers. This behaviour is in qualitative agreement with the proposed reaction scheme.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
U. Hofmann and K.G. Weil, Dechema-Monographien 121 (1990) 257.
M. Benje, U. Hofmann, U. Pitterman and K.G. Weil, Ber.Bunsenges. Phys. Chem. 92 (1988) 1257.
W. Riedel, Galvanotechnik 81 (3) (1990) 842.
G.O. Mallory and V.A. Loyd, Plat. Surf. Finish. 72 (1985) 52.
T. Kobayashi, J. Ishibashi, S. Mononobe, M. Ohtsu and H. Honma, J. Electrochem. Soc. 147 (2000) 1046.
Chun-Jen Chen and Kwang-Lung Lin, J. Electrochem. Soc. 146 (1999) 137.
M. Cherkaoui, A. Srhiri and E. Chassaing, Plat. Surf. Finish. 79 (1992) 68.
M. Ebntouhami, M. Cherkaoui, A. Srhiri, A. Benbachir and E. Chassaing, J. Appl. Electrochem. 26 (1996) 487.
M. Ebntouhami, E. Chassaing and M. Cherkaoui, Electrochim.Acta 43 (1998) 1721.
J. Chitty, A. Pertuz, H. Hintermann, M.H. Staia and E.S. Puchi, Thin Solid Films 308–309 (1997) 430.
R.L. Zeller III and U. Landau, J. Electrochem. Soc. 137 (1990) 1107.
J.J. Kelly, K.M.A. Rahman, C.J. Durning and A.C. West, J. Electrochem. Soc. 145 (1998) 492.
M. Saaoudi, M. Ebntouhami, M. Cherkaoui, A. Srhiri, A. Ben Bachir, M. Elhark and A. Tanji, French patent 2 754 831 (1998).
I. Bakonyi, A. Cziraki, I. Nagy and M. Hosso, Z. Metallkunde 77 (1986) 425.
K-H. Hur, J. Mat Sci. 25 (1990) 2573.
J-P. Bonino, S. Bruet-Hotellaz, C. Bories, P. Pouderoux and A. Rousset, J. Appl. Electrochem. 27 (1997) 1193.
C. Gabrielli and F. Raulin, J. Appl. Electrochem. 1 (1971) 167.
J. Crousier, Z. Hanane and J-P. Crousier, Thin Solid Films 248 (1994) 51.
R. Stevanovic, J. Stevanovic and A. Despic, J. Appl. Electrochem. 29 (1999) 747.
J. Crousier, Z. Hanane and J-P. Crousier, Electrochim. Acta 38 (1993) 261.
L.M. Abrantes, M.C. Oliveira, J.P. Bellier and J. Lecoeur, Electrochim. Acta 39 (1994) 1915.
I. Ohno, Mater. Sci. Eng. A146 (1991) 33.
L.M. Abrantes and J.P. Correia, J. Electrochem. Soc. 141 (1994) 2356.
L.M. Abrantes, M.C. Oliveira and E. Vieil, Electrochim. Acta 41 (1996) 1515.
L.M. Abrantes and M.C. Oliveira, J. Electrochem. Soc. 147 (2000) 2981.
L.V. Sastri, R.E. Huie and P. Neta, J. Phys. Chem. 94 (1990) 1895.
E. Chassaing, M. Joussellin and R. Wiart, J. Electroanal. Chem. 157 (1983) 75.
A. Brenner, ‘Electrodeposition of Alloys’, Vol. 1–2 (Academic Press, New York, 1963).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Saaoudi, M., Chassaing, E., Cherkaoui, M. et al. Hydrogen incorporation in Ni–P films prepared by electroless deposition. Journal of Applied Electrochemistry 32, 1331–1336 (2002). https://doi.org/10.1023/A:1022691218053
Issue Date:
DOI: https://doi.org/10.1023/A:1022691218053