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Thermal Analysis Characterization of a Commercial Thermoplastic/Thermoset Adhesive

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Abstract

DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process. Beneficial synergy between these analysis tools is demonstrated in this study.

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Authors and Affiliations

  1. Bell Labs, Lucent Technologies, 2H37, 2000 Northeast Expy, Norcross, GA, 30071-2992, USA

    P. L. Tabaddor, C. J. Aloisio, C. H. Plagianis & C. R. Taylor

  2. Bell Labs, 600-700 Mountain Avenue, PO Box 636, Murray Hill, NJ, 07974-0636, USA

    H. E. Bair

Authors
  1. P. L. Tabaddor
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  2. C. J. Aloisio
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  3. H. E. Bair
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  4. C. H. Plagianis
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  5. C. R. Taylor
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Tabaddor, P.L., Aloisio, C.J., Bair, H.E. et al. Thermal Analysis Characterization of a Commercial Thermoplastic/Thermoset Adhesive. Journal of Thermal Analysis and Calorimetry 59, 559–570 (2000). https://doi.org/10.1023/A:1010166230313

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  • DOI: https://doi.org/10.1023/A:1010166230313

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