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Tensile testing of MEMS materials—recent progress

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Abstract

Tension tests, while standardized for common structural materials, are currently being developed and used for MEMS materials by a small number of researchers. This paper presents recent progress at Hopkins in four areas:

• Comparison of the tensile test method with different approaches; agreement is found with Young's modulus measurements from membrane tests and with fracture strengths from other tensile tests.

• Tension-tension fatigue; increased life with decreased applied stress is measured, yielding S-N plots similar to those of metals.

• Stress versus axial and lateral strain of thick-film silicon carbide; Young's modulus = 420 GPa, Poisson's ratio = 0.21, fracture strength = 0.8 GPa.

• Polysilicon stress-strain behavior at high temperatures; it deforms inelastically at temperatures above 750°C

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References

  1. T. Tsuchiya, O. Tabata, J. Sakata and Y. Taga, The Tenth Annual International Workshop on Micro Electro Mechanical Systems (1997) p. 529.

  2. S. Greek, F. Ericson, S. Johansson and J. Schweitz, Transducers' 95 (1995) p. 56.

  3. D. A. Lavan, T. E. Bucheit and P. G. Kotula, “Microscale Systems: Mechanics and Measurements Symposium” (Society for Experimental Mechanics, 2000) p. 41.

  4. D. T. Read and R. C. Marshall, in Proceedings of SPIE 2880 (1996) p. 56.

  5. I. Chasiotis and W. G. Knauss, “Microscale Systems: Mechanics and Measurements Symposium” (Society for Experimental Mechanics, 2000) p. 56.

  6. J. C. Bravman, P. Shang and H. J. Lee, ASME Mechanics and Materials Summer Conference (2001) p. 128.

  7. H. Kapels, R. Aigner and J. Binder, IEEE Transactions on Electron Devices 47 (2000) 1522.

    Google Scholar 

  8. M. A. Haque and M. T. A. Saif, Transducers' 01 (2001) p. 1374.

  9. T. Yoshioka, T. Ando, M. Shikida and K. Sato, Sensors and Actuators 82 (2000) 291.

    Google Scholar 

  10. W. N. Sharpe, Jr., B. Yuan and R. L. Edwards, J. Microelectromech. Syst. 6 (1997) p. 193.

    Google Scholar 

  11. W. N. Sharpe, Jr., K. T. Turner and R. L. Edwards, Experim. Mech. 39 (1999) 162.

    Google Scholar 

  12. W. N. Sharpe, Jr., “The MEMS Handbook,” chap. 3 (CRC Press, 2001).

  13. D. A. Lavan, T. Tsuchiya, G. Coles, W. G. Knauss, I. Chasiotis and D. Read, “ASTMSTP” (2001) vol. 1413.

  14. W. N. Sharpe, Jr., K. Jackson, G. Coles and D. A. Lavan, ASME Symposium on Micro-Electro-Mechanical Systems (2000) p. 255.

  15. S. B. Brown, W. van Arsdell and C. L. Muhlstein, Transducers' 97 (1997) p. 591.

  16. H. Kahn, R. Ballarini, R. L. Mullen and A. H. Heuer, in Proceedings of the Royal Society of London (1999) vol. 455, p. 3807.

    Google Scholar 

  17. W. N. Sharpe, Jr., M. A. Eby and G. Coles, Transducers' 01 (2001) p. 1366.

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Sharpe, W.N., Bagdahn, J., Jackson, K. et al. Tensile testing of MEMS materials—recent progress. Journal of Materials Science 38, 4075–4079 (2003). https://doi.org/10.1023/A:1026313102468

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  • DOI: https://doi.org/10.1023/A:1026313102468

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