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Copper UPD on Selenium-Modified Polycrystalline Pt Electrode

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Abstract

Underpotential deposition of Cu onto an Se-modified smooth polycrystalline Pt electrode in an acidic CuSO4 solution was investigated using a cyclic voltammetry. It was obtained that the specific voltammetric pattern of Cu UPD observed for a clean Pt electrode disappeared and a new current peak at potentials much closer to bulk Cu deposition was formed. This feature of a cyclic voltammogram is similar to that observed earlier for clean Pt electrode in acidic CuSO4 solutions containing selenite and also to that described for S-modified Pt electrode in an additive-free CuSO4 solution. The reasons for the difference in the voltammetric behavior of bare Pt and Se-modified Pt in the potential range characteristic of Cu UPD were considered. A model of Cu deposition taking place onto the free Pt sites at more positive potentials and onto the Se-covered ones at less positive potentials was discussed with closer scrutiny.

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  1. Institute of Chemistry, A. Gosčtauto 9, 2600, Vilnius, Lithuania

    A. Steponavicčius & D. Sčimku¯naiteė

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  1. A. Steponavicčius
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  2. D. Sčimku¯naiteė
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Steponavicčius, A., Sčimku¯naiteė, D. Copper UPD on Selenium-Modified Polycrystalline Pt Electrode. Russian Journal of Electrochemistry 38, 488–495 (2002). https://doi.org/10.1023/A:1015480926089

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