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Microindentation induced debonding of polymer thin films from rigid substrates

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Abstract

A microindenter in the form of a flat cylindrical punch (10 μm < diameter < 100 μm) is used to measure the interfacial shear strength of polymer coatings on relatively rigid substrates. The penetration of the displacement controlled tip in the polymer results in a plastic zone ahead of the moving tip, which generates a large interfacial shear stress. An analysis based on a modified shear lag model can be used to estimate the critical shear stress at which failure of the interface initiates. The test can be used for hard and soft polymers such as polymethylmethacrylate, polystyrene and high impact polystyrene. The thickness of coating which can be tested is shown to be approximately equal to the diameter of the tip.

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Authors and Affiliations

  1. Department of Mechanical and Materials Engineering, The University of Western Ontario, London, Canada, N6A 5B9

    Y. Lu & D. M. Shinozaki

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  1. Y. Lu
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  2. D. M. Shinozaki
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Correspondence to D. M. Shinozaki.

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Lu, Y., Shinozaki, D.M. Microindentation induced debonding of polymer thin films from rigid substrates. Journal of Materials Science 37, 1283–1293 (2002). https://doi.org/10.1023/A:1014506823464

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