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Chemical mechanical planarization of copper: pH effect

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Advanced Materials Processing and Analysis Center, University of Central Florida, Orlando, FL, 32826, USA

    T. Du & V. Desai

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  1. T. Du
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  2. V. Desai
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Du, T., Desai, V. Chemical mechanical planarization of copper: pH effect. Journal of Materials Science Letters 22, 1623–1625 (2003). https://doi.org/10.1023/A:1026353028626

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