Abstract
A chemical vapour deposition–fluidized bed reactor technique was developed to perform metal deposition on ceramic particulates. Experiments of nickel and copper deposition on Al2O3 and SiC particulates were conducted. Argon was used as the carrier gas to fluidize the ceramic particulates. The metal–H–Cl system was selected for the chemical vapour deposition. The volumetric ratios of the inlet gas were 3.5% HCl, 20.0% H2, and 76.5% Ar. The deposition reactions were carried out at four different temperatures: 500, 600, 700 and 800 °C. Successful deposition of metallic nickel and copper on the ceramic particulates was observed. It was also noticed that the deposition rates varied with the types of substrates and deposited metals.
Access this article
We’re sorry, something doesn't seem to be working properly.
Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.
Similar content being viewed by others
References
M. M. SCHWARTZ, ‘‘Composite Materials Handbook’’ (McGraw-Hill, New York, 1982).
A. MORTENSEN and I. JIN, Inter. Mater. Rev. 37(3) (1992) 101.
C.-L. TSAO and S.-W. CHEN, J. Mater. Sci. 30 (1995) 5215.
S. L. I. CHAN and C. C. CHANG, in ‘‘Proceedings of the 1995 Annual Conference of the Chinese Society for Materials Science’’, Vol. II, (Chinese Society for Materials Science, 1995) pp. 388–89.
P. L. CHEN, J. Vacuum Soc. ROC 5(2) (1992) 4.
J. GAYNOR, Chem. Engng Prog. 56(7) (1960) 75.
A. H. LANDROCK, ibid. 63(2) (1967) 67.
J. M. BOLCHER Jr, US Pat. 3249 509 (1966).
J. GUILLERAY, R. L. R. LEFEVRE, M. S. T. PRICE and J. P. THOMAS, in ‘‘Proceedings of the 5th International Conference on CVD’’, edited by J. M. Bolcher Jr, H. H. Hinterman and L. H. Hall (Electrochemical Society, Princeton, NJ, 1975) pp. 727–48.
W. J. McCREARY, ibid., pp. 714–25.
G. ARTHUR and M. P. JOHNSON, ibid., pp. 509–22.
J. L. KAAE, Ceram. Engng Sci. Proc. 9 (1988) 1159.
A. SANJURJO, M. C. H. McKUBRE and G. D. CRAIG, Surf. Coat. Technol. 39/40 (1989) 691.
S. MOROOKA, T. OKUBO and K. KUSAKABE, Powder Technol. 63 (1990) 105.
I. KIMURA, N. HOTTA, J.-I. NIWANO and M. TANAKA,ibid. 68 (1991) 153.
A. SANJURJO, B. J. WOOD, K. H. LAU, G. T. TONG, D. K. CHOI, M. C. H. McKUBRE, H. K. SONG, D. PETERS and N. CHURCH, Surf. Coat. Technol. 49 (1991) 103.
A. SANJURJO, B. J. WOOD, K. H. LAU, G. T. TONG, D. K. CHOI, M. C. H. McKUBRE, H. K. SONG and N. CHURCH, ibid. 49 (1991) 110.
B. J. WOOD, A. SANJURJO, G. T. TONG and S. E. SWIDER, ibid. 49 (1991) 228.
K. H. LAU, A. SANJURJO and B. J. WOOD, ibid. 54/55 (1992) 234.
A. SANJURJO, US Pat. 5171 734 (1992).
K. TSUGEKI, T. KATO, Y. KOYANAGI, K. KUSAKABE and S. MOROOKA, J. Mater. Sci. 28 (1993) 3168.
S. KINKEL, G. N. ANGELOPOULOS and W. DAHL, Surf. Coat. Technol. 64 (1994) 119.
R. W. REYNOLDSON, Ind. HeatingSeptember (1994) 126.
A.-J. CHANG, S.-W. RHEE and S. BAIK, J. Mater. Sci. 30 (1995) 1180.
R. H. BUSEY and W. F. GIAUQUE, J. Amer. Chem. Soc. 75 (1953) 1791.
M. W. CHASE Jr, J. L. CURNUTT, J. R. DOWNEY Jr, R. A. McDONALD, A. N. SYVERUD and E. A. VALENZUELA, J. Phys. Chem. Ref. Data 11 (1982) 695.
O. KUBASCHEWSKI, E. LL. EVANS and C. B. ALCOCK, ‘‘ Metallurgical Thermochemistry’’ (Pergamon Press, London, 1967) pp. 414–26.
D. T. WILLIAMS, S. K. EL-RAHAIBY and Y. K. RAO, Metall. Trans. 12B (1981) 161.
D. KUNII and O. LEVENSPIEL, ‘‘Fluidization Engineering’’, 2nd Ed. (Butterworth-Heinemann, Boston, 1991).
H. E. CARLTON and J. H. OXLEY, AIChE J. 13(1) (1967) 86.
P. J. CLEMENTS and F. R. SALE, Metall. Trans. 7B (1976) 435.
T. MARUYAMA and T. TAGO, J. Mater. Sci. 28 (1993) 5345.
Y. UEMURA, Y. HATATE and A. IKARI, J. Chem. Engng Jpn. 22(1) (1989) 48.
L. VAN HEMERT, B. SPENDLOVE and R. E. SIEVERS, J. Electrochem. Soc. 112 (1965) 1123.
Y. IHARA, H. OHGAME and K. SAKIYAMA, Corros. Sci. 22 (1982) 901.
K.-L. LIN and C.-S. JONG, Mater. Chem. Phys. 35 (1993) 53.
D.-H. KIM, R. H. WENTORF and W. N. GILL, J. Electrochem. Soc. 140 (1993) 3267.
B. LECOHIER, J.-M. PHILIPPOZ and H. VAN DEN BERGH, J. Vac. Sci. Technol. B 10 (1991) 262.
R. KUMAR, F. R. FRONCZEK, A. W. MAVERICK, W. G. LAI and G. L. GRIFFIN, Chem. Mater. 4 (1992) 577.
V. L. YOUNG, D. F. COX and M. E. DAVIS, ibid. 5 (1993)1701.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
CHEN, CC., CHEN, SW. Nickel and copper deposition on Al2O3 and SiC particulates by using the chemical vapour deposition–fluidized bed reactor technique. Journal of Materials Science 32, 4429–4435 (1997). https://doi.org/10.1023/A:1018644511672
Issue Date:
DOI: https://doi.org/10.1023/A:1018644511672