Abstract
Testing techniques based on the functional behaviour, the propagation delay and the levels of quiescent current have been used with great success for the last two decade technologies. However, the efficiency of such techniques is dubious for future technologies, characterised by huge mixed-mode complex circuits and very low supply voltage levels. In this paper the feasibility of using internal thermal sensors to detect heat sources provoked by structural defects are considered and evaluated.
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Altet, J., Rubio, A., Claeys, W. et al. Differential Thermal Testing: An Approach to its Feasibility. Journal of Electronic Testing 14, 57–66 (1999). https://doi.org/10.1023/A:1008397205559
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DOI: https://doi.org/10.1023/A:1008397205559