New metal ion and plasma surface modification methods
Introduction
In order to improve performance characteristics of metallic details and units, significant concentrations and doses of embedded atoms are necessary. This requires the development of high-productivity and, at the same time, simple and reliable equipment realizing novel methods of ion processing.
The development of equipment and methods providing a wide spectrum of high-productivity technological regimes for implantation in conducting materials, in which a high concentration of embedded atoms (up to 100 at.%) at a sample's surface can be achieved, is anticipated. Such concentrations are necessary to obtain good adhesion properties of deposited coatings. It also seems crucially important to develop methods providing simple and reliable modes of ion implantation into dielectrics and ion assisted metal plasma deposition, which are applicable equally to conducting or dielectric samples.
In this paper, the complex of ion and plasma processing methods developed at NPI is described. It is based on the usage of vacuum arc microparticle-filtered metal plasma and repetitively-pulsed formation of ion beams and streams from this plasma, making possible different modes of ion implantation and ion assistance for metal plasma deposition.
Section snippets
Repetitively-pulsed ion beam assisted metal plasma deposition
The method of ion beam assisted deposition (IBAD), widely investigated in recent years, is a unique instrument for the formation of high-quality coatings with excellent adhesion properties [1], [2], [3], [4], [5]. The ion beam and plasma sources developed at NPI allow a wide range of opportunities for metal plasma ion beam assisted deposition technological regimes [6], [7], [8]. First of all, it should be noted that at a fixed current of vacuum arc discharge and, correspondingly, a fixed
High-concentration ion implantation (HCII)
One of the limitations of the potential of the method of ion implantation is connected with ion sputtering of the surface layer during the process of ion beam bombardment. By reducing the sputtering coefficient S or fully eliminating the effect of surface sputtering at ion implantation, one can increase, correspondingly, by S times (at full elimination of sputtering) the maximum achievable concentration and maximum dose of implanted impurity.
This task becomes especially important for the
High-frequency metal plasma-immersion ion implantation and deposition
The method of high-frequency short-pulsed plasma-immersion ion implantation and deposition (HFSPPI3D) can be used either by itself or to extend the range of technological possibilities of installations containing the sources of “Raduga-5” type, including those with additional vacuum arc plasma generators with plasma filters.
The HFSPPI3D method [12], [13] has a number of advantages in comparison with the usual approach to realization of metal plasma-immersion ion implantation and deposition (MPI3
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A review of high-energy processing techniques applied for additive manufacturing and surface engineering of cemented carbides and cermets
2023, Journal of Manufacturing ProcessesPrediction of the composition of surface alloys formed via pulsed melting of preliminary deposited coatings
2022, Materials Chemistry and PhysicsCitation Excerpt :Surface modification of metals and alloys by processing with concentrated energy flows (CEFs) is one of the most promising and attractive materials science methods, which enable to improve both individual characteristics of parts and the reliability of an entire device as a whole [1–3]. Upon processing, the surface layer is rapidly heated and then cooled, which causes subsequent structural phase transformations [4–6]. The chemical composition of treated layers varies due to both diffusion and convective processes in the liquid state.
High-energy surface processing of zirconium alloys for fuel claddings of water-cooled nuclear reactors
2021, Nuclear Engineering and DesignCitation Excerpt :Research results on plasma treatment of zirconium and its alloys (two ones, only) are systematized in Table 11 on the basis of papers (Perlovich et al., 2004; Belous et al., 2013; Begrambekov et al., 2015; Evsin et al., 2015a, 2016b, 2016c, 2016d, 2019e; Wang et al., 2016; Sartowska et al., 2016; Sutygina et al., 2017; Kashkarov et al., 2018; Obrosov et al., 2018; Ryabchikov et al., 2020; Kornilov and Glazova, 1967). It should be noted that this method of surface modification can be implemented using a wide range of equipment of various designs (Brown et al., 1999; Gavrilov and Oks, 2000; Ryabchikov and Stepanov, 2007). Accordingly, conditions of plasma treatment and functional properties of the modified layers have been very different.
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