Elsevier

Solid-State Electronics

Volume 113, November 2015, Pages 179-183
Solid-State Electronics

Experimental demonstration of improved analog device performance of nanowire-TFETs

https://doi.org/10.1016/j.sse.2015.05.032Get rights and content

Abstract

We present experimental data on analog device performance of p-type planar- and gate all around (GAA) nanowire (NW) Tunnel-FETs (TFETs) as well as on n-type Tri-Gate-TFETs. A significant improvement of the analog performance by enhancing the electrostatics from planar TFETs to GAA-NW-TFETs with diameters of 20 nm and 10 nm is demonstrated. A maximum transconductance of 122 μS/μm and on-currents up to 23 μA/μm at a gate overdrive of Vgt = Vd = −1 V were achieved for the GAA NW-pTFETs. Furthermore, a good output current-saturation is observed leading to high intrinsic gain up to 217. The Tri-Gate nTFETs beat the fundamental MOSFET limit for the subthreshold slope of 60 mV/dec and by that also reach extremely high transconductance efficiencies up to 82 V−1.

Introduction

Tunnel-FETs (TFETs) can be operated at ultralow supply voltages due to their ability to reach inverse subthreshold slopes well below 60 mV/dec [1] and their small off-state currents. Consequently, they could outperform MOSFETs in terms of energy efficiency, subthreshold characteristics and intrinsic gain, thus attracting huge interest as post CMOS-devices [2]. TFETs are not only interesting for digital applications but also for low power analog [3] and sensor applications such as ultrasensitive biomolecule and pH-detectors [4]. Up to now, experimental as well as theoretical works focused mainly on digital applications of TFETs. Only a few theoretical studies on analog and sensor application of TFETs have been published [3], [4], [5], [6], [7], [8], [9] and even less experimental data are available [10], [11]. The transconductance gm = Id/∂Vg, output conductance gd = Id/∂Vd and intrinsic voltage gain Ai = gm/gd are important figures of merit for analog circuit design. Furthermore, the transconductance efficiency gm/Id is a measure of analog power efficiency and is closely related to the inverse subthreshold slope SS. SS below 60 mV/dec has been experimentally demonstrated in TFETs already 10 years ago [12], however, up to now many TFET concepts suffer from low on-currents and low gm. Continuous improvement of tunnel junctions is leading to higher on currents [13] and simulations show that TFETs can outperform MOSFETs in respect of intrinsic gain, especially due to good output current saturation (small gd) [5]. In this work, we present experimental data on gm, gd, Ai as well as on the transconductance efficiency gm/Id of state of the art silicon based p-type planar and gate all around (GAA) nanowire (NW) TFETs as well as on tri-gate n-TFETs. The results are compared with experimental and simulation data for MOSFETs and TFETs from literature.

Section snippets

Device fabrication

In this study TFETs of two device generations have been analyzed. The devices of the first generation were symmetric doped tri-gate TFETs. The TFETs were fabricated on 15 nm thick SOI substrate by patterning with electron beam lithography followed by reactive ion etching such that 40 nm wide NWs were formed. A high-k/metal gate stack consisting of 3 nm HfO2 and 50 nm TiN was deposited by atomic layer deposition (ALD) and atomic vapor deposition AVD, respectively and patterned to a gate length of 250

Results and discussion

First, ambipolar Tri-Gate devices were investigated. These devices can operate as p- and n-type devices, as shown in the transfer characteristics in Fig. 2a.

Whereas the p-branch of these devices shows a minimum SS of 90 mV/dec. The n-branch beats the Boltzmann tyranny of 60 mV/dec. With SSmin = 29 mV/dec the n-TFET outperforms the physical limit of a MOSFET. The transconductance efficiency gm/Id is an important analog device performance parameter as it balances the amplification with the current

Conclusion

Experimental key-parameters for analog device application of planar, Tri-gate and GAA-NW-TFETs have been presented. Significant improvements in analog device performance by optimized device geometry going from planar technology to GAA-NWs have been demonstrated. The devices show comparable high values of intrinsic gain making them promising for low power operational amplifiers. Moreover, for TFETs they offer high gm in combination with high on-current and good output saturation. In addition,

Acknowledgements

The research leading to these results has received funding from the European Community’s Seventh Framework Programme under grant agreement No. 619509 (project E2SWITCH) and the German BMBF project “UltraLowPower” (No. 16ES0060K).

References (20)

There are more references available in the full text version of this article.

Cited by (9)

  • Analytical modeling approach to drain current characterization of ionization irradiated dual material trigate TFET

    2022, Micro and Nanostructures
    Citation Excerpt :

    Radiation exposed device performance of dual material trigate TFET is evaluated in this section with emphasis on its analytical results and subsequent comparison with relevant simulated data obtained from Silvaco ATLAS device simulator [27]. Calibration of BTBT model of tunneling current is performed with measured experimental data as reported by Christian Schulte-Braucks et al. [28]. Kane's model along with conventional drift diffusion model is incorporated in the simulation framework for capturing conduction phenomenon of the present structure.

  • Hetero structure PNPN tunnel FET: Analysis of scaling effects on counter doping

    2018, Applied Surface Science
    Citation Excerpt :

    We find that at VGS = 0.4 V, and for pocket lengths 2–4 nm, Output Conductance gradually reduces and subsequently saturates with drain voltage accumulation. It is almost identical to traditional MOS transistors [25] whose gd declines to lower value and saturate with rise in drain voltage. However, at VGS = 1.0 V, gd increases to a higher value and then declines to lower value.

  • Performance analysis of gate all around GaAsP/AlGaSb CP-TFET

    2018, Superlattices and Microstructures
    Citation Excerpt :

    GAA structure is especially chosen in this work for its superior electrostatic control [20]. Experimental demonstration of GAA has also been successfully performed in Ref. [21]. This paper is divided into VI sections.

  • Analytical modeling of graded metal graded dielectric silicon-on-nothing TFET -A comparative study

    2019, 2018 International Conference on Computing, Power and Communication Technologies, GUCON 2018
View all citing articles on Scopus
View full text