Thermomigration of Ti in flip-chip solder joints
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Cited by (11)
Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration
2023, Journal of the Mechanics and Physics of SolidsComparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag<inf>3</inf>Sn nanoparticles and Ag micro-alloying elements
2020, MaterialiaCitation Excerpt :With the miniaturization of electronic devices, the area array interconnection of Sn-base solder balls is a widely used technology in integrated circuit packages due to its low cost, high-density input/output (I/O), and high interconnection performance [1–3]. However, traditional drum-shaped solder joints of Sn-based solder joints formed by controlled collapse chip connection technology (C4) make two adjacent I/O solder bumps in touch easily, especially in the structure of small bump pitch, and lead to the short circuit [4–6]. Compared with the drum-shaped solder joints, the hourglass-shaped solder joints can greatly increase the spacing of the adjacent solder bumps, reduce the current crowding effect at the entrance of electrons and prolong the mean-time-to-failure (MTTF) of solder joints enhancing the reliability of solder joints under stressing current [7,8].
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient
2016, Journal of Alloys and CompoundsCitation Excerpt :Presently, thermomigration (TM) induced by temperature gradient across solid solder joints is recognized as a crucial concern in the reliability evaluation of micro solder joints in service. It has been reported that TM can result in asymmetrical growth of interfacial IMCs [4], recrystallization and redistribution of IMCs in solder [5], formation of interfacial voids [6,7], and consequent reliability issues [8,9]. Generally, solder bumps need to go through several reflows [1].
Asymmetrical growth of Cu <inf>6</inf>Sn <inf>5</inf> intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
2012, IntermetallicsCitation Excerpt :Because of the low microbump height, the cross interaction across the two ends of a microbump becomes very serious. On thermomigration, many studies reported that it occurs during accelerated electromigration tests in flip chip solder joints and it may cause damage in the neighboring joints which carried no current [2–10]. Huang et al. calculated that a thermal gradient of 1000 °C/cm is needed to observe thermomigration of Sn and Pb atoms during electromigration tests [4].
Thermomigration in solder joints
2012, Materials Science and Engineering R: ReportsCitation Excerpt :Then, the Si chip is flipped over to align to a polymer substrate, and then they are reflowed for chip-join [19]. For microbump fabrication, a Si chip is aligned to another Si chip and they are reflowed for about 1 min [54,55]. During the joining processes, the solder needs to be melted to react with UBM to form IMCs.
Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint
2022, Acta Metallurgica Sinica (English Letters)