Fragmentation of diffusion zone in high-temperature oxidation of copper

https://doi.org/10.1016/j.jssc.2004.07.058Get rights and content

Abstract

Using thermogravimetry, microscopy and X-ray diffraction, high-temperature (600–900 °C) oxidation of copper wires and plates has been studied. An abrupt decrease in reaction rate after complete consumption of metal phase but long before reaching equilibrium has been observed. This phenomenon is connected to an irregular character of the development of the reaction diffusion zone. In contrast to the usually applied layer model, initially formed oxide layers separate into numerous aggregates of Cu2O crystals chaotically scattered throughout the zone between thinner layers of CuO grains. Such fragmentation of the diffusion zone is induced by macro- and microcracks formed in copper scale under influence of mechanical stresses at metal-oxide phase boundary due to the difference in molar volume between copper and its oxides. The pattern of cracks provides channels of fast diffusion and maintains the reaction rate at high level but only until the source of crack formation remains in action.

Graphical abstract

Pattern of diffusion fluxes in fragmented copper scale symbolizes the central conception of the paper.

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Introduction

A very special place occupied by copper in the history of human civilization seems to remind of itself again in the unique role of cuprates among high-temperature superconductors and other advanced materials intensively studied during the last decades. This supports the interest to many aspects of copper physical and chemical behavior and, in particular, to the properties of copper oxides and their formation.

The phase equilibria and nonstoichiometry of oxides in the system Cu–O have been studied, starting with classical works of the first half of the 20th century, quite completely and reviewed in many literature sources, e.g., [1], [2], [3], [4]. The data of different authors on the kinetics of high-temperature oxidation of metallic copper to oxide Cu2O agree with each other as well as with the measurements of electrical conductivity and isotope diffusion [1], [2], [4], [5], [6], [7]. At the same time, the details of deeper copper oxidation to CuO are much less lucid. In fact, there are no reports on kinetic studies in the course of complete copper oxidation to single-phased CuO as an equilibrium product. Valenci (as cited in [4], [6]) noticed that the copper scale formed on metallic surface in air up to 1000 °C contains both CuO and Cu2O layers in ratio that depends on the temperature of oxidation. It has been reported also that copper scale contains both CuO and Cu2O not only in the course of reaction but also after complete oxidation of metallic phase [5], [6]. This observation shows that equilibrium state was not reached in these studies otherwise it contradicts to both phase rule and p(O2)–T phase diagram [1] according to which the equilibrium phase under stated conditions is CuO. In spite of these facts, the reported data on the parabolic rate constants of copper scale formation in air are in fair agreement between each other [1], [2], [5], [6].

The aim of this work is the study of oxidation kinetics and also composition, structure and development of reaction diffusion zone in the course of copper oxidation in air in temperature interval 600–900 °C.

Section snippets

Experimental

The specimens of electro-technical copper 99.99% pure in the form of wires 0.30 and 1.7 mm in diameter and also plates 0.10 and 0.50 mm thick have been used in the study.

The equilibria and kinetics of copper oxidation were studied gravimetrically in the experimental setup shown schematically in Fig. 1. Continuous measurement of the specimen mass (±0.1 mg) was conducted by an electronic balance (VLA-200, Novosibirsk) connected to a recording potentiometer. The specimen was suspended with a Pt wire

Retardation of oxidation kinetics

The results of gravimetric study of copper oxidation under isothermal conditions at 600, 700, 800 and 900 °C in air are presented in Fig. 2 as dependences of the overall oxygen content in the specimen, expressed as x in CuOx, on time. In all experimental runs, an abrupt decrease in reaction rate is observed at values of x somewhat higher than 0.5. For example, the average oxygen content in the specimen of copper wire 1.7 mm in diameter reaches x=0.50 after 38 h of oxidation at 900 °C (Fig. 2d).

Conclusions

The structure of the diffusion zone undergoes a series of basic rearrangements in the process of deep copper oxidation. They take place against the background of increasing packing density of recrystallizing tenorite CuO grains in oxide layer. Initially, highly permeable fine-grained tenorite layer is formed on the specimen's surface. Then, after the outer dense layer of recrystallized CuO grains develops, the two-layered oxide zone with dominating Cu2O layer arises. Under mechanical stress due

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